| PART |
Description |
Maker |
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| SC70-5 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| SC70-6 |
Surface mounted / 5 pin package Package outline
|
Zetex Semiconductors
|
| AP2301BGN-HF AP2301BGN-HF-14 |
2.8 A, 20 V, 0.13 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2309AGN-HF |
3.4 A, 30 V, 0.075 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| WDFN2X2-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP3X3-5 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN2X2-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN4X4-28 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP8X7-56 |
Package Outline
|
Global Mixed-mode Techn...
|
| WLCSP3X3-9 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-24-EP |
Package Outline
|
Global Mixed-mode Techn...
|
